Metallurgy and Materials Science
Electron Microscopy and Image Analysis (2-2) 3 Cr. Hrs.
This course introduces the fundamentals of Scanning Electron Microscopy (SEM) and quantitative Image Analysis (IA) currently used in support of effective materials, characterization and evaluations. Topics covered in the course include microscopy systems and components, applications in fractography and quantifiable measurements used in process and surface failure analysis, materials characterization and product development studies. The course is recommended for students specifically interested in specialized laboratory practices.
(A requirement that must be completed before taking this course.)
Upon successful completion of the course, the student should be able to:
- Investigate the use and application of Scanning Electron Microscopy in the field of materials science.
- Investigate the use and application of x-ray spectrographic analysis in the field of materials science.
- Investigate the use and application of x-ray stress analysis in the field of materials science.
- Prepare samples for evaluation in the scanning electron microscope.
- Interpret characteristic features of selected materials using both secondary electron imaging and backscattered electron imaging.
- Interpret characteristic x-ray spectra on selected materials.
- Identify different fracture surface morphologies.
- Interpret characteristic features of different fracture surface morphologies.
- Investigate the principles of optical microscopy and image analysis as related to use in materials science.
- Examine the use of quantitative microscopy on specialized applications in materials science.
- Investigate the principles of failure analysis as related to the study of materials science.
- Incorporate case studies of failure analysis to current applications.
Currently no sections of this class are being offered.
Note: This schedule updates once every 24 hours. Please reference WebAdvisor for current status.